FSM 128NT
The FSM 128 is an automated stress measurement tool. This tool measures wafer curvature, bow and other important information using a non-contact technique that will not damage the wafer. FSM 128 is designed to measure the amount of curvature of semiconductor wafers in a production environment requiring high reliability and performance.
DESCRIPTION SPECIFICATIONS
- Stress range: 1 x 107to 4 x 1010 dynes/cm2 (10 power 7)
- Wafer bow sensitivity 1 micron bow height change. P doped Si
- Wafer sizes: 50mm, 100mm, 150mm, and 200mm
- Scan range Up to 194mm with 3mm edge exclusion
- Mapping:Multiple scan lines for wafer maps up to 32 line scans, 6 lines recommended.
- Data Acqusition:40 points/mm along line scan
- Scan line:Single scan line at any wafer orientation
- The system is able to determine film stress (either compressive or tensile) from 1X107 dynes/cm2 to 4X1010 dynes/cm2
- System is capable of performing single scan line or multi scan lines for stress or wafer bow mapping.
- Motorized rotational stage for 2D film stress and wafer bow mapping.
- Capable of measuring very bow wafers of up to 300um bow height.
- Windows 7,8,10 &11 operating system.
- Software for stress, radius and wafer bow.
- Export of data to excel.
- Export of tables, graphs and maps as jpeg files.
Result Presentaion
Scans at different angles across the diameter of the wafer are different from each other revealing that the wafer is not a perfect sphere.
FSM 128L
Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading and retrieval. c
Features
- Accept wafer up to 300mm.
- Patented automatic dual laser switching.
- Motorized rotational stage for 2D film stress and wafer bow mapping.
- Capable of measuring very bow wafers of up to 300um bow height.
- Windows 7,8,10 &11 operating system.
- Software for stress, radius and wafer bow.
- Export of data to excel.
- Export of tables, graphs and maps as jpeg files.
FSM128 C2C
Dedicated Film Stress mapping system with high resolution for high throughput process control for wafers up to 200mm diameter. Fully automated cassette to cassette, SECS/GEM Film Stress and Bow Measurement tool. Dual or single load port configurations available. Integrated wafer substrate thickness measurement available.
Features
- Robotic cassette to cassette Film Stress measurement system
- Single open cassette load port configuration
- Fully automatic loading of 200mm wafers from open cassette
- Notch Pre-Aligner
- Patented automatic dual laser to cover measurement of a wide range of films
- Motorized rotational stage for mapping up to 32-line scans providing 2D and 3D film stress and wafer bow maps
- 2D/3D film stress and wafer bow maps
- High speed with throughput of greater than 50 wafers/hour
- Capable of measuring very bowed wafers of up to 300μm bow height.
- Windows 7, 8, 10 &11 operating system.
- Software for stress, radius and wafer bow.
