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Stress Tool

FSM 128L Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading.
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FSM 500TC Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films during thermal cycling up to 500 degrees C in inert gas.
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FSM 900TC Rapid Thermal Mechanical Characterization of novel materials. Simultaneous extraction of stress hysteresis, thermal desorption during thermal cycling up to 900C.
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RAMAN 360 Micro Raman system for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution.
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Thickness Tool

FSM413-MOT Thickness and total thickness variation (TTV) mapping system. TTV & Thickness, Roughness of wafer, thick layers, wafers on tape & bonded wafers.
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F50s F50s are general-purpose film thickness measurement instruments, and are used in thousands of applications worldwide. Thickness measured in less than a second.
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TMS-2000 The TMS-2000 can measure the flatness of the wafer with up to 1 nm repeatability. Unique data acquisition software for consistent measurement.
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M-2000 ELLIPSOMETER The M-2000® line of spectroscopic ellipsometers is engineered to meet the diverse demands of thin film characterization. An advanced optical design.
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Defect Inspection

Surfscan® SP7XP The Surfscan® SP7XP unpatterned wafer inspection system facilitates qualification and monitoring of processes and tools for IC, wafer and materials manufacturers.
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Candela® 8720 The Candela® 8720 advanced surface inspection system captures a variety of mission-critical substrate and epitaxial defects for the LED, photonics.
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W SERIES MICRO XRF W Series uses poly-capillary optics to focus the X-ray beam to 7.5 µm FWHM, the world’s smallest for coating thickness analysis using XRF instruments.
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HMI eScan 1100 The multiple e-beam wafer inspection system for in-line defect inspection applications. Following in the footsteps of the eScan 1000, It offers high throughput ..
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